Publication:

The impact of the pad surface temperature control on W CMP performance

Date

2018-10
Proceedings Paper
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dc.contributor.authorRoyere, Gael
dc.contributor.authorTeugels, Lieve
dc.contributor.authorIto, Ban
dc.contributor.authorIizumi, Takeshi
dc.contributor.authorDurix, Fabien
dc.contributor.authorDevriendt, Katia
dc.contributor.authorOng, Patrick
dc.contributor.authorStruyf, Herbert
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.date.accessioned2021-10-26T02:53:14Z
dc.date.available2021-10-26T02:53:14Z
dc.date.embargo9999-12-31
dc.date.issued2018-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31689
dc.identifier.urlhttp://cmpugm.com/2018/sub/Program_book.pdf
dc.source.beginpageC6
dc.source.conferenceInternational Conference on Planarization CMP Technology - ICPT
dc.source.conferencedate14/10/2018
dc.source.conferencelocationSeoul South Korea
dc.title

The impact of the pad surface temperature control on W CMP performance

dc.typeProceedings paper
dspace.entity.typePublication
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