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First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Publication:
First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
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Date
2019-05
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wei, Tiwei
;
Oprins, Herman
;
Beyne, Eric
;
Cherman, Vladimir
;
De Wolf, Ingrid
;
Baelmans, Martine
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1864
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Acq. date: 2025-12-10
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Metrics
Views
1864
since deposited on 2021-10-27
1
last month
Acq. date: 2025-12-10
Citations