Publication:
First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Date
| dc.contributor.author | Wei, Tiwei | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Baelmans, Martine | |
| dc.contributor.imecauthor | Wei, Tiwei | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-27T23:19:45Z | |
| dc.date.available | 2021-10-27T23:19:45Z | |
| dc.date.issued | 2019-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/34427 | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8811393 | |
| dc.source.beginpage | 126 | |
| dc.source.conference | IEEE 69th Electronic Components and Technology Conference - ECTC | |
| dc.source.conferencedate | 28/05/2019 | |
| dc.source.conferencelocation | Las Vegas, NV USA | |
| dc.source.endpage | 134 | |
| dc.title | First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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