Publication:
Interconnect and packaging technologies for realizing miniaturized smart devices
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T12:43:37Z | |
| dc.date.available | 2021-10-15T12:43:37Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8583 | |
| dc.source.conference | Philips International Symposium on Hardware Technology Drivers of Ambient Intelligence (AmI) | |
| dc.source.conferencedate | 9/12/2004 | |
| dc.source.conferencelocation | Koningshof, Veldhoven The Netherlands | |
| dc.title | Interconnect and packaging technologies for realizing miniaturized smart devices | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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