Publication:

Development of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning

Date

2015
Proceedings Paper
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dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorDecoster, Stefan
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-22T20:06:10Z
dc.date.available2021-10-22T20:06:10Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25466
dc.identifier.urlhttp://ecst.ecsdl.org/content/69/8/207.abstract?related-urls=yes&legid=ecst;69/8/207
dc.source.beginpage207
dc.source.conferenceSemiconductor Cleaning Science and Technology 14 - SCST 14
dc.source.conferencedate11/10/2015
dc.source.conferencelocationPhoenix, AZ USA
dc.source.endpage214
dc.title

Development of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning

dc.typeProceedings paper
dspace.entity.typePublication
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