Publication:

SILC and TDDB reliability of novel low thermal budget RMG gate stacks

Date

2024

Proceedings Paper

https://doi.org/10.1109/IRPS48228.2024.10529347

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Author(s)

;

Degraeve, Robin

;

Horiguchi, Naoto

;

De Wolf, Ingrid

;

Journal

N/A

Metrics

582 since deposited on 2024-08-16

Acq. date: 2025-12-15