Publication:

Process development for a novel low loss and non-PFAS photo imageable dielectric for RF silicon interposer applications

Date

2024

Proceedings Paper

https://doi.org/10.1109/3DIC63395.2024.10830178

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Author(s)

Jafarpoorchekab, Hamideh

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Sinha, Siddhartha

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Collaert, Nadine

Journal

N/A

Statistics

165 since deposited on 2025-06-21

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Acq. date: 2026-03-17