Publication:

Process development for a novel low loss and non-PFAS photo imageable dielectric for RF silicon interposer applications

 
dc.contributor.authorJafarpoorchekab, Hamideh
dc.contributor.authorSun, Xiao
dc.contributor.authorUruena, Angel
dc.contributor.authorSinha, Siddhartha
dc.contributor.authorPinho, Nelson
dc.contributor.authorMiller, Andy
dc.contributor.authorCollaert, Nadine
dc.contributor.imecauthorJafarpoorchekab, Hamideh
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorUruena, Angel
dc.contributor.imecauthorSinha, Siddhartha
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecJafarpoorchekab, Hamideh::0009-0008-8524-0885
dc.contributor.orcidimecSun, Xiao::0000-0002-2468-8933
dc.contributor.orcidimecUruena, Angel::0000-0001-8559-5063
dc.contributor.orcidimecSinha, Siddhartha::0000-0003-4025-2854
dc.contributor.orcidimecPinho, Nelson::0000-0002-0701-5921
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2025-06-30T11:51:05Z
dc.date.available2025-06-21T03:56:15Z
dc.date.available2025-06-30T11:51:05Z
dc.date.issued2024
dc.identifier.doi10.1109/3DIC63395.2024.10830178
dc.identifier.eisbn979-8-3315-1650-5
dc.identifier.isbn979-8-3315-1651-2
dc.identifier.issn2164-0157
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45818
dc.publisherIEEE
dc.source.conference2024 International 3D Systems Integration Conference
dc.source.conferencedateSEP 25-27, 2024
dc.source.conferencelocationSendai
dc.source.journalN/A
dc.source.numberofpages6
dc.subject.keywordsWAVE PHASED-ARRAYS
dc.title

Process development for a novel low loss and non-PFAS photo imageable dielectric for RF silicon interposer applications

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections: