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e-beam Metrology for High-NA: Revisiting the imec Protocol

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-0286-7997
cris.virtual.orcid0000-0002-6377-4199
cris.virtual.orcid0009-0008-6879-2178
cris.virtual.orcid0000-0003-1283-0258
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4370-5062
cris.virtual.orcid0000-0003-4745-0167
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3927-5207
cris.virtualsource.departmentc37070f0-689e-46b2-9fa4-5bbf6d4aa658
cris.virtualsource.departmentfde8f386-0ddb-42e1-ad64-53cde7dda12d
cris.virtualsource.department45b3c197-6661-4f60-a2ed-4a867012d28f
cris.virtualsource.departmentf6dc1a8c-4627-4915-aa1a-21d8e1a022bd
cris.virtualsource.department12b93184-bc22-4404-876c-0272cc95cf85
cris.virtualsource.department4a8b9964-4471-41ab-a0c3-215a0d1acfbc
cris.virtualsource.department264c186e-7bc4-4bed-8d4f-11fe1bff9e26
cris.virtualsource.departmentaf7a2ba6-eb7f-4eb5-817b-079fe2e7c07b
cris.virtualsource.department6d3c12ff-d1ca-4ea8-bb8d-a09f3b7736ee
cris.virtualsource.departmentffad9b55-9af5-4edb-8c86-134820dc8dd9
cris.virtualsource.orcidc37070f0-689e-46b2-9fa4-5bbf6d4aa658
cris.virtualsource.orcidfde8f386-0ddb-42e1-ad64-53cde7dda12d
cris.virtualsource.orcid45b3c197-6661-4f60-a2ed-4a867012d28f
cris.virtualsource.orcidf6dc1a8c-4627-4915-aa1a-21d8e1a022bd
cris.virtualsource.orcid12b93184-bc22-4404-876c-0272cc95cf85
cris.virtualsource.orcid4a8b9964-4471-41ab-a0c3-215a0d1acfbc
cris.virtualsource.orcid264c186e-7bc4-4bed-8d4f-11fe1bff9e26
cris.virtualsource.orcidaf7a2ba6-eb7f-4eb5-817b-079fe2e7c07b
cris.virtualsource.orcid6d3c12ff-d1ca-4ea8-bb8d-a09f3b7736ee
cris.virtualsource.orcidffad9b55-9af5-4edb-8c86-134820dc8dd9
dc.contributor.authorLorusso, Gian Francesco
dc.contributor.authorMoussa, Alain
dc.contributor.authorHabashieh, Sahel
dc.contributor.authorVan Den Heuvel, Dieter
dc.contributor.authorVangoidsenhoven, Diziana
dc.contributor.authorGupta, Mihir
dc.contributor.authorSuh, Hyo Seon
dc.contributor.authorChen, Ying-Lin
dc.contributor.authorDe Simone, Danilo
dc.contributor.authorMack, Chris
dc.contributor.authorSun, Wei
dc.contributor.authorSugie, Masaki
dc.contributor.authorFoubert, Philippe
dc.contributor.authorIsawa, Miki
dc.contributor.authorCharley, Anne-Laure
dc.contributor.imecauthorLorusso, Gian Francesco
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorHabashieh, Sahel
dc.contributor.imecauthorVan den Heuvel, Dieter
dc.contributor.imecauthorVangoidsenhoven, Diziana
dc.contributor.imecauthorGupta, Mihir
dc.contributor.imecauthorSuh, Hyo Seon
dc.contributor.imecauthorChen, Ying-Lin
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.imecauthorFoubert, Philippe
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.orcidimecMoussa, Alain::0000-0002-6377-4199
dc.contributor.orcidimecVan Den Heuvel, Dieter::0009-0008-6879-2178
dc.contributor.orcidimecGupta, Mihir::0000-0003-0286-7997
dc.contributor.orcidimecSuh, Hyo Seon::0000-0003-4370-5062
dc.contributor.orcidimecChen, Ying-Lin::0000-0003-1283-0258
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.contributor.orcidimecCharley, Anne-Laure::0000-0003-4745-0167
dc.date.accessioned2025-07-28T03:57:58Z
dc.date.available2025-07-28T03:57:58Z
dc.date.issued2025
dc.description.wosFundingTextThis work has been enabled in part by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania.
dc.identifier.doi10.1117/12.3052366
dc.identifier.eisbn978-1-5106-8639-7
dc.identifier.isbn978-1-5106-8638-0
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45962
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage134260L-1
dc.source.conference2025 Conference on Metrology Inspection and Process Control-Annual
dc.source.conferencedate2025-02-24
dc.source.conferencelocationSan Jose
dc.source.endpage134260L-13
dc.source.journalProceedings of SPIE
dc.source.numberofpages13
dc.title

e-beam Metrology for High-NA: Revisiting the imec Protocol

dc.typeProceedings paper
dspace.entity.typePublication
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