Publication:
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
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2 since deposited on 2021-10-26
Acq. date: 2025-10-23
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2117 since deposited on 2021-10-26
Acq. date: 2025-10-23
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2 since deposited on 2021-10-26
Acq. date: 2025-10-23
Views
2117 since deposited on 2021-10-26
Acq. date: 2025-10-23
Citations