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Improved low-k dielectric properties using He/H2 plasma for resist removal

Date

2008
Meeting abstract
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dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorShamiryan, Denis
dc.contributor.authorMarsik, Premysl
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorVanstreels, Kris
dc.contributor.authorFerchichi, Abdelkarim
dc.contributor.authorDe Roest, David
dc.contributor.authorSprey, Hessel
dc.contributor.authorMatsushita, K.
dc.contributor.authorKaneko, S.
dc.contributor.authorTsuji, N.
dc.contributor.authorLuo, S.
dc.contributor.authorEscorcia, O.
dc.contributor.authorBerry, Ivan
dc.contributor.authorWaldfried, Carlo
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-17T11:29:15Z
dc.date.available2021-10-17T11:29:15Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14590
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.title

Improved low-k dielectric properties using He/H2 plasma for resist removal

dc.typeMeeting abstract
dspace.entity.typePublication
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