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Conference contributions
3D TCAD model for poly-Si channel current and variability in vertical NAND flash memory
Publication:
3D TCAD model for poly-Si channel current and variability in vertical NAND flash memory
Date
2019
Proceedings Paper
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41866.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Verreck, Devin
;
Arreghini, Antonio
;
Schanovsky, Franz
;
Stanojevic, Zlatan
;
Steiner, K.
;
Mitterbauer, F.
;
Karner, Markus
;
Van den Bosch, Geert
;
Furnemont, Arnaud
Journal
Abstract
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2047
since deposited on 2021-10-27
443
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Acq. date: 2025-10-24
Citations
Metrics
Views
2047
since deposited on 2021-10-27
443
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations