Publication:

Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

Date

Loading...
Thumbnail Image

Abstract

Description

Statistics

Views

2008 since deposited on 2021-10-18
2last month
2last week
Acq. date: 2026-07-18

Citations

Statistics

Views

2008 since deposited on 2021-10-18
2last month
2last week
Acq. date: 2026-07-18

Citations