Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

dc.contributor.author	Maestre Caro, Arantxa
dc.contributor.author	Armini, Silvia
dc.contributor.author	Richard, Olivier
dc.contributor.author	Maes, Guido
dc.contributor.author	Borghs, Gustaaf
dc.contributor.author	Whelan, Caroline M.
dc.contributor.author	Travaly, Youssef
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.imecauthor	Richard, Olivier
dc.contributor.imecauthor	Borghs, Gustaaf
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimec	Richard, Olivier::0000-0002-3994-8021
dc.date.accessioned	2021-10-18T18:36:52Z
dc.date.available	2021-10-18T18:36:52Z
dc.date.embargo	9999-12-31
dc.date.issued	2010
dc.identifier.issn	1616-301X
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/17546
dc.source.beginpage	1125
dc.source.endpage	1131
dc.source.issue	7
dc.source.journal	Advanced Functional Materials
dc.source.volume	20
dc.title	Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers
dc.type	Journal article
dspace.entity.type	Publication
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