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Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technology
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Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technology
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Date
1999
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kim, Young-Chang
;
Baklanov, Mikhaïl
;
Conard, Thierry
;
de Potter de ten Broeck, Muriel
;
Vanhaelemeersch, Serge
Journal
J. Electrochem. Soc.
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1904
since deposited on 2021-10-06
1
last month
Acq. date: 2025-12-09
Citations
Metrics
Views
1904
since deposited on 2021-10-06
1
last month
Acq. date: 2025-12-09
Citations