Publication:

Influence of pre and post process conditions on the composition of thin Si3N4 thin films (3nm) studied by XPS and TOFSIMS

Date

2000
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorConard, Thierry
dc.contributor.authorDe Witte, Hilde
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorHoussa, Michel
dc.contributor.authorHeyns, Marc
dc.contributor.authorPomarede, C.
dc.contributor.authorWerkhoven, Chris
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorHoussa, Michel
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecHoussa, Michel::0000-0003-1844-3515
dc.date.accessioned2021-10-14T12:45:36Z
dc.date.available2021-10-14T12:45:36Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4217
dc.source.beginpage69
dc.source.conferenceStructure and Electronic Properties of Ultrathin Dielectrics on Silicon and Related Structures; November 1999; Boston, MA, USA.
dc.source.conferencelocation
dc.source.endpage74
dc.title

Influence of pre and post process conditions on the composition of thin Si3N4 thin films (3nm) studied by XPS and TOFSIMS

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions