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Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
Publication:
Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
Date
2013
Proceedings Paper
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27291.pdf
1.31 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Guo, Wei
;
Moroz, Victor
;
Van der Plas, Geert
;
Choi, M.
;
Redolfi, Augusto
;
Smith, L.
;
Eneman, Geert
;
Van Huylenbroeck, Stefaan
;
Su, P.D.
;
Ivankovic, Andrej
;
De Wachter, Bart
;
Debusschere, Ingrid
;
Croes, Kris
;
De Wolf, Ingrid
;
Mercha, Abdelkarim
;
Beyer, Gerald
;
Swinnen, Bart
;
Beyne, Eric
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since deposited on 2021-10-21
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1
since deposited on 2021-10-21
Acq. date: 2025-10-24
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2017
since deposited on 2021-10-21
Acq. date: 2025-10-24
Citations