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Articles
Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
Publication:
Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
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Date
2011
Journal article
https://doi.org/10.1016/j.mee.2010.08.013
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Armini, Silvia
;
Tokei, Zsolt
;
Volders, Henny
;
El-Mekki, Zaid
;
Radisic, Alex
;
Beyer, Gerald
;
Ruythooren, Wouter
;
Vereecken, Philippe
Journal
Microelectronic Engineering
Abstract
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1923
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Views
1923
since deposited on 2021-10-19
2
last month
2
last week
Acq. date: 2025-12-16
Citations