Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options

dc.contributor.author	Armini, Silvia
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Volders, Henny
dc.contributor.author	El-Mekki, Zaid
dc.contributor.author	Radisic, Alex
dc.contributor.author	Beyer, Gerald
dc.contributor.author	Ruythooren, Wouter
dc.contributor.author	Vereecken, Philippe
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Volders, Henny
dc.contributor.imecauthor	El-Mekki, Zaid
dc.contributor.imecauthor	Radisic, Alex
dc.contributor.imecauthor	Beyer, Gerald
dc.contributor.imecauthor	Ruythooren, Wouter
dc.contributor.imecauthor	Vereecken, Philippe
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimec	Vereecken, Philippe::0000-0003-4115-0075
dc.contributor.orcidimec	El-Mekki, Zaid::0000-0002-9851-9139
dc.date.accessioned	2021-10-19T12:29:36Z
dc.date.available	2021-10-19T12:29:36Z
dc.date.issued	2011
dc.identifier.doi	10.1016/j.mee.2010.08.013
dc.identifier.issn	0167-9317
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/18489
dc.source.beginpage	754
dc.source.endpage	759
dc.source.issue	5
dc.source.journal	Microelectronic Engineering
dc.source.volume	88
dc.title	Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
dc.type	Journal article
dspace.entity.type	Publication
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