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Conference contributions
Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage
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Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage
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Date
2018
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chanson, Romain
;
Tillocher, Thomas
;
Lefaucheux, Philippe
;
Dussart, Remi
;
Zhang, Liping
;
de Marneffe, Jean-Francois
;
Shen, P
;
Dussarrat, Chrsitian
;
Maekawa, Kaoru
;
yatsuda, koichi
;
Tahara, Shigeru
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1954
since deposited on 2021-10-25
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Acq. date: 2025-12-10
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Metrics
Views
1954
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-10
Citations