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Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
Publication:
Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
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Date
2020
Proceedings Paper
https://doi.org/10.1109/ESTC48849.2020.9229662
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Mirdamadi, S. Hossein
;
Derakhshandeh, Jaber
;
Cochet, Tom
;
Beyne, Eric
;
Beyer, Gerald
;
Miller, Andy
;
mirda
Journal
na
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1759
since deposited on 2021-11-02
Acq. date: 2025-12-15
Citations
Metrics
Views
1759
since deposited on 2021-11-02
Acq. date: 2025-12-15
Citations