Publication:

Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB

Date

2020
Proceedings Paper
https://doi.org/10.1109/ESTC48849.2020.9229662
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dc.contributor.authorMirdamadi, S. Hossein
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCochet, Tom
dc.contributor.authorBeyne, Eric
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authormirda
dc.contributor.imecauthorMirdamadi, S. Hossein
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-01-27T09:50:34Z
dc.date.available2021-11-02T16:03:16Z
dc.date.available2022-01-27T09:50:34Z
dc.date.issued2020
dc.identifier.doi10.1109/ESTC48849.2020.9229662
dc.identifier.eisbn978-1-7281-6293-5
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38043
dc.publisherIEEE
dc.source.conference8th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 15-18, 2020
dc.source.conferencelocationVestfold
dc.source.journalna
dc.source.numberofpages8
dc.title

Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB

dc.typeProceedings paper
dspace.entity.typePublication
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