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Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device
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Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device
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Date
2005
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
De Coster, Jeroen
;
De Moor, Piet
;
Puers, Bob
;
Tilmans, Harrie
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1849
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last month
Acq. date: 2025-12-15
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Metrics
Views
1849
since deposited on 2021-10-16
5
last month
Acq. date: 2025-12-15
Citations