Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device

dc.contributor.author	Jourdain, Anne
dc.contributor.author	De Coster, Jeroen
dc.contributor.author	De Moor, Piet
dc.contributor.author	Puers, Bob
dc.contributor.author	Tilmans, Harrie
dc.contributor.imecauthor	Jourdain, Anne
dc.contributor.imecauthor	De Coster, Jeroen
dc.contributor.imecauthor	De Moor, Piet
dc.contributor.imecauthor	Puers, Bob
dc.contributor.imecauthor	Tilmans, Harrie
dc.contributor.orcidimec	Tilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned	2021-10-16T02:23:22Z
dc.date.available	2021-10-16T02:23:22Z
dc.date.issued	2005
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/10663
dc.source.beginpage	222
dc.source.conference	Proceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate	12/06/2005
dc.source.conferencelocation	Brugge Belgium
dc.source.endpage	227
dc.title	Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device
dc.type	Proceedings paper
dspace.entity.type	Publication
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