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Conference contributions
Heterogeneous system integration using silicon interposer and 3D stacking technology
Publication:
Heterogeneous system integration using silicon interposer and 3D stacking technology
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Date
2016
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33644.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
Journal
Abstract
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since deposited on 2021-10-23
Acq. date: 2025-12-16
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1809
since deposited on 2021-10-23
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Acq. date: 2025-12-16
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Downloads
1
since deposited on 2021-10-23
Acq. date: 2025-12-16
Views
1809
since deposited on 2021-10-23
3
last month
Acq. date: 2025-12-16
Citations