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Heterogeneous system integration using silicon interposer and 3D stacking technology

Date

2016
Meeting abstract
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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T10:06:55Z
dc.date.available2021-10-23T10:06:55Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26336
dc.source.beginpage502
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate1/02/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Heterogeneous system integration using silicon interposer and 3D stacking technology

dc.typeMeeting abstract
dspace.entity.typePublication
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