Sealed ultra low-k organosilica films with unprecedented electrical and mechanical properties

dc.contributor.author	Goethals, F.
dc.contributor.author	Levrau, E.
dc.contributor.author	Pollefeyt, G.
dc.contributor.author	Baklanov, Mikhaïl
dc.contributor.author	Ciofi, Ivan
dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Detavernier, C.
dc.contributor.author	Van Driessche, I.
dc.contributor.author	Van Der Voort, P.
dc.contributor.imecauthor	Ciofi, Ivan
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.orcidimec	Ciofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned	2021-10-21T07:53:35Z
dc.date.available	2021-10-21T07:53:35Z
dc.date.issued	2013
dc.identifier.issn	2050-7526
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/22407
dc.identifier.url	http://pubs.rsc.org/en/content/articlelanding/2013/tc/c3tc30522h#!divAbstract
dc.source.beginpage	3961
dc.source.endpage	3966
dc.source.issue	25
dc.source.journal	Journal of Materials Chemistry C
dc.source.volume	1
dc.title	Sealed ultra low-k organosilica films with unprecedented electrical and mechanical properties
dc.type	Journal article
dspace.entity.type	Publication
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