Reliable via-middle copper through-silicon via technology for 3-D integration

dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-23T10:07:02Z
dc.date.available	2021-10-23T10:07:02Z
dc.date.embargo	9999-12-31
dc.date.issued	2016
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/26338
dc.identifier.url	https://ieeexplore.ieee.org/document/7329969
dc.source.beginpage	983
dc.source.endpage	992
dc.source.issue	7
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	6
dc.title	Reliable via-middle copper through-silicon via technology for 3-D integration
dc.type	Journal article
dspace.entity.type	Publication
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