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The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers
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The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers
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Date
1999
Proceedings Paper
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3251.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carchon, Geert
;
Brebels, Steven
;
Pieters, Philip
;
Vaesen, Kristof
;
Vandenberghe, S.
;
Schreurs, Dominique
;
De Raedt, Walter
;
Nauwelaers, Bart
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1879
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Acq. date: 2025-12-16
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Metrics
Views
1879
since deposited on 2021-10-06
1
last month
Acq. date: 2025-12-16
Citations