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The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers

Date

1999
Proceedings Paper
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dc.contributor.authorCarchon, Geert
dc.contributor.authorBrebels, Steven
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorVandenberghe, S.
dc.contributor.authorSchreurs, Dominique
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorSchreurs, Dominique
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.date.accessioned2021-10-06T10:47:12Z
dc.date.available2021-10-06T10:47:12Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3288
dc.source.beginpage755
dc.source.conferenceInternational Symposium on Recent Advances in Microwave Technology - ISRAMT
dc.source.conferencedate13/12/1999
dc.source.conferencelocationMalaga Spain
dc.source.endpage758
dc.title

The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers

dc.typeProceedings paper
dspace.entity.typePublication
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