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Presentations
Copper wire bonding to advanced copper back-end integrated circuits
Publication:
Copper wire bonding to advanced copper back-end integrated circuits
Date
2003
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
;
Ho, Meng
;
Stoukatch, Serguei
;
Lam, Kan Wai
;
Ratchev, Petar
;
Degryse, Dominiek
;
Vath III, C.J.
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1994
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1994
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations