Publication:

Copper wire bonding to advanced copper back-end integrated circuits

Date

2003
Presentation
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dc.contributor.authorBeyne, Eric
dc.contributor.authorHo, Meng
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorLam, Kan Wai
dc.contributor.authorRatchev, Petar
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVath III, C.J.
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T04:01:17Z
dc.date.available2021-10-15T04:01:17Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7209
dc.source.conferenceSemicon Europe, Advanced Packaging Seminar
dc.source.conferencedate31/03/2003
dc.source.conferencelocationMunich Germany
dc.title

Copper wire bonding to advanced copper back-end integrated circuits

dc.typeOral presentation
dspace.entity.typePublication
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