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A novel resist and post-etch residue removal process using ozonated chemistry

Date

1998
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dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorSnee, Peter
dc.contributor.authorCornelissen, Ingrid
dc.contributor.authorLux, Marcel
dc.contributor.authorVos, Rita
dc.contributor.authorMertens, Paul
dc.contributor.authorKnotter, Martin
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorCornelissen, Ingrid
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-09-30T11:41:42Z
dc.date.available2021-09-30T11:41:42Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2492
dc.source.conference4th International Symposium on Ultra Clean Processing of Silicon Surfaces - UCPSS
dc.source.conferencedate21/09/1998
dc.source.conferencelocationOostende Belgium
dc.title

A novel resist and post-etch residue removal process using ozonated chemistry

dc.typeOral presentation
dspace.entity.typePublication
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