Publication:
A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
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2048 since deposited on 2021-10-20
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Acq. date: 2026-04-28
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Statistics
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2048 since deposited on 2021-10-20
1last month
1last week
Acq. date: 2026-04-28
Citations