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Automated voids detection for metal filled trenches with bottom CD of 10nm

 
dc.contributor.authorHosseini, Maryam
dc.contributor.authorMartinez Alanis, Gerardo Tadeo
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorHoriguchi, Naoto
dc.contributor.imecauthorHosseini, Maryam
dc.contributor.imecauthorMartinez Alanis, Gerardo Tadeo
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecHosseini, Maryam::0000-0002-0210-4095
dc.contributor.orcidimecMartinez Alanis, Gerardo Tadeo::0000-0001-5036-0491
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.date.accessioned2022-09-26T09:54:06Z
dc.date.available2022-05-05T02:17:27Z
dc.date.available2022-09-26T09:54:06Z
dc.date.issued2021
dc.identifier.doi10.1109/IITC51362.2021.9537485
dc.identifier.eisbn978-1-7281-7632-1
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39741
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
dc.source.conferencelocationKyoto
dc.source.journalna
dc.source.numberofpages3
dc.title

Automated voids detection for metal filled trenches with bottom CD of 10nm

dc.typeProceedings paper
dspace.entity.typePublication
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