Publication:

New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding

Date

2023

Proceedings Paper

https://doi.org/10.1109/ECTC51909.2023.00027

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Author(s)

De Messemaeker, Joke

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Witters, Liesbeth

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Journal

N/A

Metrics

849 since deposited on 2023-10-24

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Acq. date: 2026-01-06