Publication:
New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Witters, Liesbeth | |
| dc.contributor.author | Zhang, Boyao | |
| dc.contributor.author | Tsau, Thomas | |
| dc.contributor.author | Fodor, Ferenc | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Witters, Liesbeth | |
| dc.contributor.imecauthor | Zhang, Boyao | |
| dc.contributor.imecauthor | Fodor, Ferenc | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Croes, Kristof | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Tsau, Thomas | |
| dc.contributor.orcidimec | De Messemaeker, Joke::0000-0002-4872-0176 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Witters, Liesbeth::0000-0002-0772-5501 | |
| dc.contributor.orcidimec | Zhang, Boyao::0000-0002-7976-0146 | |
| dc.date.accessioned | 2024-06-04T13:51:18Z | |
| dc.date.available | 2023-10-24T17:34:31Z | |
| dc.date.available | 2024-06-04T13:51:18Z | |
| dc.date.issued | 2023 | |
| dc.description.wosFundingText | This work was supported by the partners of the 3D System Integration program of imec. The authors wish to thank Hiroshi Itokawa (KIOXIA) for his help with data analysis. | |
| dc.identifier.doi | 10.1109/ECTC51909.2023.00027 | |
| dc.identifier.eisbn | 979-8-3503-3498-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42944 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 109 | |
| dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
| dc.source.conferencelocation | Orlando | |
| dc.source.endpage | 113 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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