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Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts
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Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts
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Date
2013-05
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Badaroglu, Mustafa
;
Vandevelde, Bart
;
Gonzalez, Mario
;
Van der Plas, Geert
;
Beyne, Eric
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1866
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations
Metrics
Views
1866
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations