Publication:

Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts

Date

2013-05
Proceedings Paper
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dc.contributor.authorOprins, Herman
dc.contributor.authorBadaroglu, Mustafa
dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBadaroglu, Mustafa
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T10:38:32Z
dc.date.available2021-10-21T10:38:32Z
dc.date.issued2013-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22891
dc.source.beginpage2183
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage2188
dc.title

Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts

dc.typeProceedings paper
dspace.entity.typePublication
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