Publication:

Development of compression molding process for Fan-Out wafer level packaging

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00306
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Author(s)

Bertheau, Julien  
;
Duval, Fabrice  
;
Kubota, Tadashi  
;
Bex, Pieter  
;
Kennes, Koen  
;
Phommahaxay, Alain  
;
Podpod, Arnita  
;
Beyne, Eric  
;
Miller, Andy  
;
Beyer, Gerald  

Journal

na

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1875 since deposited on 2021-11-02
2last month
Acq. date: 2026-06-05

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