Publication:
Development of compression molding process for Fan-Out wafer level packaging
| dc.contributor.author | Bertheau, Julien | |
| dc.contributor.author | Duval, Fabrice | |
| dc.contributor.author | Kubota, Tadashi | |
| dc.contributor.author | Bex, Pieter | |
| dc.contributor.author | Kennes, Koen | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Podpod, Arnita | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.imecauthor | Julien, Bertheau | |
| dc.contributor.imecauthor | Fabrice, Duval F. C. | |
| dc.contributor.imecauthor | Pieter, Bex | |
| dc.contributor.imecauthor | Koen, Kennes | |
| dc.contributor.imecauthor | Alain, Phommahaxay | |
| dc.contributor.imecauthor | Arnita, Podpod | |
| dc.contributor.imecauthor | Eric, Beyne | |
| dc.contributor.imecauthor | Andy, Miller | |
| dc.contributor.imecauthor | Gerald, Beyer | |
| dc.contributor.imecauthor | Bertheau, Julien | |
| dc.contributor.imecauthor | Duval, Fabrice | |
| dc.contributor.imecauthor | Kubota, Tadashi | |
| dc.contributor.imecauthor | Bex, Pieter | |
| dc.contributor.imecauthor | Kennes, Koen | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Podpod, Arnita | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-12-16T13:51:01Z | |
| dc.date.available | 2021-11-02T16:04:36Z | |
| dc.date.available | 2021-12-16T13:51:01Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00306 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38150 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1965 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.conferencelocation | Orlando, FL, USA | |
| dc.source.endpage | 1972 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 8 | |
| dc.title | Development of compression molding process for Fan-Out wafer level packaging | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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