Publication:
Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips
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1883 since deposited on 2021-10-19
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Acq. date: 2026-04-06
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Statistics
Views
1883 since deposited on 2021-10-19
4last month
3last week
Acq. date: 2026-04-06
Citations