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Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips

Date

2011-03
Proceedings Paper
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dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorStucchi, Michele
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T16:56:57Z
dc.date.available2021-10-19T16:56:57Z
dc.date.issued2011-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19519
dc.source.beginpage131
dc.source.conferenceIEEE/CPMT 27th Semiconductor Thermal Measurement & Management Symposium - SEMI-THERM
dc.source.conferencedate20/03/2011
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage137
dc.title

Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips

dc.typeProceedings paper
dspace.entity.typePublication
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