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Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.
Publication:
Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.
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Date
2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00269
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kennes, Koen
;
Guerrero, Alice
;
Salahouelhadj, Abdellah
;
Suhard, Samuel
;
Derakhshandeh, Jaber
;
Phommahaxay, Alain
;
Brems, Steven
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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999
since deposited on 2023-10-24
Acq. date: 2025-12-11
Citations
Metrics
Views
999
since deposited on 2023-10-24
Acq. date: 2025-12-11
Citations