Publication:

Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.

Date

2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00269
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dc.contributor.authorKennes, Koen
dc.contributor.authorGuerrero, Alice
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorSuhard, Samuel
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBrems, Steven
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSuhard, Samuel::0000-0002-6650-5947
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-12-18T11:49:55Z
dc.date.available2023-10-24T17:34:32Z
dc.date.available2023-12-18T11:49:55Z
dc.date.issued2023
dc.identifier.doi10.1109/ECTC51909.2023.00269
dc.identifier.eisbn979-8-3503-3498-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42946
dc.publisherIEEE
dc.source.beginpage1584
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.endpage1589
dc.source.journalna
dc.source.numberofpages6
dc.title

Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.

dc.typeProceedings paper
dspace.entity.typePublication
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