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Conference contributions
Wet clean in BEOL interconnect: Post etch residue removal and material compatibility
Publication:
Wet clean in BEOL interconnect: Post etch residue removal and material compatibility
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Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kesters, Els
;
Le, Quoc Toan
;
Yu, David
;
Shen, Mary
;
Braun, Simon
;
Klipp, Andreas
;
Holsteyns, Frank
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1886
since deposited on 2021-10-22
Acq. date: 2025-12-10
Citations
Metrics
Views
1886
since deposited on 2021-10-22
Acq. date: 2025-12-10
Citations