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Wet clean in BEOL interconnect: Post etch residue removal and material compatibility

Date

2014
Proceedings Paper
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dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorYu, David
dc.contributor.authorShen, Mary
dc.contributor.authorBraun, Simon
dc.contributor.authorKlipp, Andreas
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorBraun, Simon
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-22T02:35:05Z
dc.date.available2021-10-22T02:35:05Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24052
dc.identifier.urlUltra Clean Processing of Semiconductor Surfaces
dc.source.beginpage201
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces - UCPSS XII
dc.source.conferencedate21/09/2014
dc.source.conferencelocationBrussels Belgium
dc.source.endpage204
dc.title

Wet clean in BEOL interconnect: Post etch residue removal and material compatibility

dc.typeProceedings paper
dspace.entity.typePublication
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