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MEMS packaging using 3D-Si integration approaches
Publication:
MEMS packaging using 3D-Si integration approaches
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Date
2008
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
;
Jourdain, Anne
Journal
Abstract
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1841
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Acq. date: 2025-12-15
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Metrics
Views
1841
since deposited on 2021-10-17
2
last month
1
last week
Acq. date: 2025-12-15
Citations