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Presentations
MEMS packaging using 3D-Si integration approaches
Publication:
MEMS packaging using 3D-Si integration approaches
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Date
2008
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
;
Jourdain, Anne
Journal
Abstract
Description
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1843
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Acq. date: 2026-01-06
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Metrics
Views
1843
since deposited on 2021-10-17
3
last month
2
last week
Acq. date: 2026-01-06
Citations