Publication:

MEMS packaging using 3D-Si integration approaches

Date

2008
Presentation
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dc.contributor.authorBeyne, Eric
dc.contributor.authorJourdain, Anne
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T06:18:17Z
dc.date.available2021-10-17T06:18:17Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13391
dc.source.conferenceIMAPS-Benelux Autumn Event
dc.source.conferencedate20/11/2008
dc.source.conferencelocationEindhoven The Nederlands
dc.title

MEMS packaging using 3D-Si integration approaches

dc.typeOral presentation
dspace.entity.typePublication
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