Publication:
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
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1312 since deposited on 2022-10-30
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Acq. date: 2026-01-06
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1312 since deposited on 2022-10-30
2last month
2last week
Acq. date: 2026-01-06
Citations