Publication:
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
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1307 since deposited on 2022-10-30
Acq. date: 2025-10-25
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Metrics
Views
1307 since deposited on 2022-10-30
Acq. date: 2025-10-25
Citations