Publication:
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
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1310 since deposited on 2022-10-30
Acq. date: 2025-12-14
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Views
1310 since deposited on 2022-10-30
Acq. date: 2025-12-14
Citations