Publication:

Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations

Date

2022
Proceedings Paper
https://doi.org/10.1109/IMW52921.2022.9779308
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Author(s)

Spessot, Alessio  
;
Salahuddin, Shairfe Muhammad  
;
Escobar Gavilanez, Ricardo  
;
Ritzenthaler, Romain  
;
Xiang, Yang  
;
Budhwani, Rahul Kumar  
;
Dentoni Litta, Eugenio  
;
Capogreco, Elena  
;
Bastos, Joao  
;
Chen, Yangyin  
;
Horiguchi, Naoto  

Journal

na

Abstract

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1316 since deposited on 2022-10-30
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Acq. date: 2026-02-24

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